Erratum to “Investigation of Insertion Loss in Inkjet-Printed Coplanar Waveguide Based on Drying Temperature”

Article information

J. Electromagn. Eng. Sci. 2026;26(1):116-116

Publication date (electronic) : 2026 January 31

doi : https://doi.org/10.26866/jees.2025.6.r.328.e

Jun Ho Yu ¹, Sung-min Sim ², Jin W. Choi ³, Sang-Ho Lee ¹^,, Jung-Mu Kim ²^,

¹Micro/Nano Scale Manufacturing R&D Group, Korea Institute of Industrial Technology, Cheonan, Korea

²Division of Electronic Engineering, Jeonbuk National University, Jeonju, Korea

³Department of Electrical and Computer Engineering, Michigan Technological University, Houghton, MI, USA

^*Corresponding Author: Sang-Ho Lee (e-mail: sholee7@kitech.re.kr) and Jung-Mu Kim (e-mail: jungmukim@jbnu.ac.kr)

This corrects the article "Investigation of Insertion Loss in Inkjet-Printed Coplanar Waveguide Based on Drying Temperature" in Volume 25 on page 550.

In the paper entitled “Investigation of Insertion Loss in Inkjet-Printed Coplanar Waveguide Based on Drying Temperature (Journal of Electromagnetic Engineering and Science, vol. 25, no. 6, pp. 550–557, 2025 https://doi.org/10.26866/jees.2025.6.r.328)”, the Acknowledgments has incorrect information.

The correct statement should read:

This work was supported by the National Research Foundation of Korea (NRF) grant funded by the Korea government (the Ministry of Science and ICT) (No. RS-2025-02303659) and partially supported by Korea Institute of Industrial Technology Research Project (KITECH EO250005, Development of Core Technologies for a Working Partner Robot in the Manufacturing Field) and Jeonbuk National University, granted financial resources from HYUNSONG Educational & Cultural Foundation.

Article information Continued

This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/by-nc/4.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.