Uncertainty of S-Parameter Measurements on PCBs due to Imperfections in the TRL Line Standard
Hyunji Koo, Martin Salter, No-Weon Kang, Nick Ridler, Young-Pyo Hong
J. Electromagn. Eng. Sci. 2021;21(5):369-378.   Published online 2021 Nov 30     DOI: https://doi.org/10.26866/jees.2021.5.r.45
Citations to this article as recorded by Crossref logo
A Method for Deembedding the Mounting Pad and Via-Hole Effect in a Test Fixture for Accurate Impedance Measurement of the Surface Mount Device Component
Sanguk Lee, Hyunwoong Kim, Jangyong Ahn, Jaewon Rhee, Jaeyong Cho, Hongseok Kim, Seungyoung Ahn
IEEE Transactions on Instrumentation and Measureme.2024; 73: 1.     CrossRef
The Impact of a Taper Impedance Transformation on the TRL De-Embedding Error
João Louro, Luís C. Nunes, Filipe M. Barradas, Pedro M. Cabral, José C. Pedro
IEEE Journal of Microwaves.2024; 4(3): 389.     CrossRef
Validation of the Reference Impedance in Multiline Calibration With Stepped Impedance Standards
Ziad Hatab, Michael Ernst Gadringer, Ahmad Bader Alothman Alterkawi, Wolfgang Bösch
IEEE Open Journal of Instrumentation and Measureme.2023; 2: 1.     CrossRef
60 GHz Electronically Tunable Leaky-Wave Antenna Based on Annular Surface Plasmon Polariton Media for Continuous Azimuth Scanning
Anirban Sarkar, Duc Anh Pham, Sungjoon Lim
IEEE Transactions on Antennas and Propagation.2022; 70(11): 10017.     CrossRef