Micromachined Low-Loss Low-Dispersion Elevated CPW for High-Speed Interconnects

S. H. Jeong,; Lee, S. N.; Lee, S. G.; J. G. Yook,; Kim, Y. J.; Park, H. K.

Journal of the Korean Institute of Electromagnetic and Science 2002;2(2):59-64.

S. H. Jeong¹, S. N. Lee², S. G. Lee³, J. G. Yook², Y. J. Kim⁴, H. K. Park²

¹Samsung Electronics Co. Ltd.
²Department of Electrical and Electronics Eng., Yonsei University
³Samsung Advanced Institute of Technology
⁴Department of Mechatronics eng., Yonsei University

Abstract

In this paper, 10$mu$ m-elevated MEMS CPWs on various substrates are presented. Effective dielectric constants of elevated CPW(ECPW) on polyimide-loaded silicon or alumina substrate are examined and characteristic impedances are also computed versus elevation height. Dispersive property of ECPW and its electromagnetic field distributions are studied through 3-D FDTD algorithm for optimum design. Attenuation of ECPW is measured with TRL calibration procedure and revealed about 3.2 43 lower than that of conventional CPW on the same low-resistivity silicon at 40 CHz. ECPW on polyimide-loaded silicon with overlapped configuration reveals 0.2 dB/mm. Especially, alumina substrate imposes better attenuation than silicon.

Key words: Elevated CPW, Low Loss, Low Dispersive, High-Speed Transmission Line